PRODUCT

 

'Full Automation'


SECS-GEM 제어기술을 접목

Auto Loader/Unloader



FCBGA Precision Auto Loading System



At Flip Chip Bonding Process,  System that load Substrate or Assembled Bottom JIG/Substrate/Top JIG  to Bonder





FCBGA Precision Auto Unloading System



At Flip Chip Bonding Process,System that unload Substrate or Separated Bottom JIG/Substrate/Top JIG with inspection

by QC Vision after Bonder & Reflow process






SMT Precision Auto loading System


At SMT Process, System that load Substrate or Assembled Bottom JIG/Substrate/Top JIG





SMT Precision Auto Unloading System



At SMT Process, System that unload Substrate or separated Bottom JIG/Substrate/Top JIG with inspection by QC Vision

after Mounter & Reflow process